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Coles VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, 2023, Sharjah, United Arab Emirates, October 16-18, Revised Extended Selected Papers at Village Green Shopping Centre in Vernon, BC
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, 2023, Sharjah, United Arab Emirates, October 16-18, Revised Extended Selected Papers
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, 2023, Sharjah, United Arab Emirates, October 16-18, Revised Extended Selected Papers in Vernon, BC
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, 2023, Sharjah, United Arab Emirates, October 16-18, Revised Extended Selected Papers in Vernon, BC
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This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023.
The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023.
The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy - and is representing cutting-edge research at the forefront of VLSI technology.
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