The motivation for this book will be to provide a comprehensive roadmap focusing on the structure/property/process/ performance relationships in thermoset polymers. Our book will focus on providing the reader with an appropriate introduction to the most common thermoset chemistries with the main focus on providing a detailed description of the curing process, and most importantly, comprehensive discussion of thermoset cure characterization using a multitude of methods.Significant new content includes a new and comprehensive treatise on characterizing the kinetics during curing. Practical examples will be provided to make measurements of curing kinetics understandable and effective.A comprehensive treatise on thermoset rheological properties and most importantly expanded the discussion of rheological measurements in the uncured liquid state. These types of rheological measurements are important in many thermoset processing methods (dispensing, mold filling, composite processing, etc.) In addition, a detailed description of chemorheology (rheology during chemical crosslinking) will be provided.Dielectric cure monitoring is a powerful, but often misunderstood characterization tool for monitoring the curing process both in the laboratory and as a manufacturing process monitoring method. A clear, easy to understand explanation of the dielectric measurements will be presented with the focus on practical applications and data analysis in monitoring the curing process in manufacturing applications.